Chip Assembly Die Bonding Process Engineer (m/f/d) - 100%
Coherent · Zurich
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- Company
- Coherent
- Location
- Zurich
- Posted
- October 29, 2026
About this job
Chip Assembly Die Bonding Process Engineer Join our semiconductor manufacturing team as a Chip Assembly Process Engineer, where you will take ownership of critical chip assembly processes including die bonding, curing, marking, and inspection. This is a hands-on engineering role focused on developing and optimizing manufacturing processes, improving yield and quality, introducing new products into production, and ensuring the reliability of advanced assembly equipment. Working closely with R&D, production, quality, and suppliers, you will play a key role in bringing innovative technologies from development into high-volume manufacturing. What You’ll Be Doing Own and continuously improve chip assembly processes, including die bonding, curing, marking, and inspection.…
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