Advanced Packaging Lead
Quantware · Delft
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- Company
- Quantware
- Location
- Delft
- Posted
- October 13, 2026
About this job
As an Advanced Packaging Lead, you’ll play a crucial role in developing our state of the art assembly technologies of quantum processors in our advanced multi-layer chip stack architecture. These components development aims to achieve best in class quantum computing performance which are in turn integrated in our VIO technology. You will define fabrication and process development projects, design of experiments, and ensure seamless integration and optimisation of all technical components. Your work will be essential as we scale to increasingly complex systems and deliver on the promise of quantum computing. What you'll be doing Plan and lead the development of back-end fabrication and assembly technologies, with a focus on enhancing the flip chip bonding techniques, contacts reliability,…
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Salaries in Germany
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