3D Chiplet Engineer
Vertical Compute · Germany · Remote-friendly
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- Company
- Vertical Compute
- Location
- Germany
- Posted
- October 22, 2026
About this job
We are looking for a 3D Integration / Chiplet Expert to define and implement 2.5D/3D advanced packaging solutions for our Vertical Integrated Memory (VIM) technology. You will collaborate across teams to define optimal interconnect strategies and die stacking approaches to enable high-bandwidth, low-power operation. This job sits at the intersection of SoC architecture (specifically the physical design), package design, and 3D manufacturing processes. Key Responsibilities: Integration Architecture & Process Definition: Develop and define architectures for 2.5D/3D stacking of VIM chiplets with compute chiplets. Collaborate with design and technology teams to develop interconnect solutions that ensure high bandwidth and low latency.…
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