PhD scholarship in Streamlining quantum chip packaging through 3D printed self-alignment structures - DTU Nanolab
DTU · Kgs. Lyngby, Denmark
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- Company
- DTU
- Location
- Kgs. Lyngby, Denmark
- Posted
- August 17, 2026
About this job
Are you interested in quantum chip packaging from both a theoretical and experimental point of view? Then this PhD project offers a unique opportunity. If you have a background in 3D design, microfabrication, and a good understanding of the interplay between materials, topology, and mechanical properties, you might be our ideal PhD candidate. Your work at DTU Nanolab would contribute to developing quick and facile solutions for alignment in photonic integrated circuit (PIC) packaging, potentially revolutionizing PIC packaging and system integration and ultimately contributing to high bandwidth and secure data transmission. Responsibilities and qualifications Your overall focus will be to design and fabricate self-alignment structures for flip-chip bonding based on lightweight high-strength…
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